Supermicro FatTwin SuperServer SYS-F619P2-FT

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SKU
SYS-F619P2-FT

Key Features:
• 8 Hot-plug System Nodes in 4U
• Supports Intel® Xeon® Scalable Processors
• Up to 1.5TB of memory
• 2 or 4 Fixed 2.5" SATA3/NVMe drive bays
• 8x 8cm 13.5k RPM rear fans per enclosure
• 2200W Redundant Power Supplies Titanium Level (96% Efficiency

Supermicro FatTwin SuperServer SYS-F619P2-FT

Product SKU
• SuperServer F619P2-FT (Black)
Motherboard
  • Super X11DPFF-SN
Processor/Cache
CPU • Dual Socket P (LGA 3647)
• Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
• Support CPU TDP 70-165W with IVR
Cores • Up to 28 Cores with Intel® HT Technology
System Memory
Memory Capacity • 12 DIMM slots
• Up to 1.5TB ECC 3DS LRDIMM, 1.5TB ECC RDIMM, DDR4 up to 2666MHz
Memory Type

• 2666/2400/2133MHz ECC DDR4 SDRAM

On-Board Devices
Chipset • Intel® C621 chipset
SATA • SATA3 (6Gbps); RAID 0, 1, 5, 10
Network Controllers • Flexible networking via SIOM
IPMI

• Support for Intelligent Platform Management Interface v.2.0
• IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

Graphics

• ASPEED AST2500 BMC

Input/Output (per node)
SATA • 12 SATA3 (6Gbps) ports
LAN • SIOM flexible Network card
• 1 RJ45 Dedicated IPMI LAN port (front)
USB • 2 USB 3.0 ports (front)
VGA • 1 VGA port (front)
System BIOS
BIOS Type

• 128Mb SPI Flash EEPROM with AMI BIOS

Management
Software

• Intel® Node Manager
• IPMI 2.0
• KVM with dedicated LAN
• SuperDoctor® 5
• Watch Dog

Power Configuration

• ACPI Power Management

PC Health Monitoring
CPU • Monitors for CPU Cores, Chipset Voltages, Memory.
• 4+1 Phase-switching voltage regulator
FAN • Fans with tachometer monitoring
• Status monitor for speed control
• Pulse Width Modulated (PWM) fan connectors
Temperature








• Monitoring for CPU and chassis environment
• Thermal Control for fan connectors







Chassis
Form Factor • 4U Rackmount
Model CSE-F418IF3-R2K20BP
Dimension and Weight
Height • 6.96" (177mm)
Width • 17.63" (448mm)
Depth • 29" (737mm)
Gross Weight • 200 lbs (90.71 kg)
Available Colors • Black
Front Panel
Buttons

• Power On/Off button
• UID button

LEDs

• Power status LED
• Network activity LEDs
• Information LED (Fan failure, Overheat)

Expansion Slots (per node)
PCI-Express

• 1 PCI-E 3.0 x16 (Low-profile)
• 1 PCI-E 3.0 x8 (Low-profile)
• 1 PCI-E 3.0 x16 (SIOM)

Drive Bays (per node)
Hot-swap

• 2 or 4 Fixed 2.5" SATA3/NVMe drive bays

M.2

• M.2 Interface: PCI-E 3.0 x4
• M.2 Form Factor: 2260, 2280, 22110
• M.2 Key: M-Key

System Cooling
Fans

• 8x 8cm 13.5k RPM rear fans per enclosure

Power Supply
  2200W or 2000W Redundant Power Supplies with PMBus
Total Output Power
and Input
• 1200W with Input 100-127Vac
• 1800W with Input 200-220Vac
• 1980W with Input 220-230Vac
• 2090W with Input 230-240Vac
• 2200W with Input 220-240Vac (for UL/cUL use only)
• 2090W with Input 230-240Vdc (for CCC only)
AC Input Frequency
• 50-60Hz
Dimension
(W x H x L)
• 76 x 40 x 336 mm
+12V • Max: 100A / Min: 0A (100-127Vac)
• Max: 150A / Min: 0A (200-220Vac)
• Max: 165A / Min: 0A (220-230Vac)
• Max: 174.17A / Min: 0A (230-240Vac)
• Max: 183.3A / Min: 0A (220-240Vac)
5VSB • Max: 1A / Min: 0A
Output Type • Backplanes (gold finger)
Certification • Titanium Level
Operating Environment
RoHS

• RoHS Compliant

Environmental Spec.
• Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
• Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
• Operating Relative Humidity: 8% to 90% (non-condensing)
• Non-operating Relative Humidity: 5% to 95% (non-condensing)
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