Supermicro FatTwin SuperServer SYS-F619P2-FT
Key Features:
• 8 Hot-plug System Nodes in 4U
• Supports Intel® Xeon® Scalable Processors
• Up to 1.5TB of memory
• 2 or 4 Fixed 2.5" SATA3/NVMe drive bays
• 8x 8cm 13.5k RPM rear fans per enclosure
• 2200W Redundant Power Supplies Titanium Level (96% Efficiency
Product SKU
| |
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SYS-F619P2-FT | • SuperServer F619P2-FT (Black) |
Motherboard
| |
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• Super X11DPFF-SN |
Processor/Cache
|
|
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CPU | • Dual Socket P (LGA 3647) • Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s • Support CPU TDP 70-165W with IVR |
Cores | • Up to 28 Cores with Intel® HT Technology |
System Memory
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Memory Capacity | • 12 DIMM slots • Up to 1.5TB ECC 3DS LRDIMM, 1.5TB ECC RDIMM, DDR4 up to 2666MHz |
Memory Type | • 2666/2400/2133MHz ECC DDR4 SDRAM |
On-Board Devices
| Chipset | • Intel® C621 chipset |
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SATA | • SATA3 (6Gbps); RAID 0, 1, 5, 10 |
Network Controllers | • Flexible networking via SIOM |
IPMI | • Support for Intelligent Platform Management Interface v.2.0 |
Graphics |
• ASPEED AST2500 BMC |
Input/Output (per node)
| SATA | • 12 SATA3 (6Gbps) ports | LAN | • SIOM flexible Network card • 1 RJ45 Dedicated IPMI LAN port (front) |
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USB | • 2 USB 3.0 ports (front) |
VGA | • 1 VGA port (front) |
System BIOS
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BIOS Type |
• 128Mb SPI Flash EEPROM with AMI BIOS |
Management
| |
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Software | • Intel® Node Manager |
Power Configuration |
• ACPI Power Management |
PC Health Monitoring
| CPU | • Monitors for CPU Cores, Chipset Voltages, Memory. • 4+1 Phase-switching voltage regulator |
FAN | • Fans with tachometer monitoring • Status monitor for speed control • Pulse Width Modulated (PWM) fan connectors |
Temperature |
• Monitoring for CPU and chassis environment • Thermal Control for fan connectors |
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Chassis
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Form Factor | • 4U Rackmount |
Model | • CSE-F418IF3-R2K20BP |
Dimension and Weight
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Height | • 6.96" (177mm) |
Width | • 17.63" (448mm) |
Depth | • 29" (737mm) |
Gross Weight | • 200 lbs (90.71 kg) |
Available Colors | • Black |
Front Panel
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Buttons | • Power On/Off button |
LEDs |
• Power status LED |
Expansion Slots (per node)
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PCI-Express | • 1 PCI-E 3.0 x16 (Low-profile) |
Drive Bays (per node)
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Hot-swap | • 2 or 4 Fixed 2.5" SATA3/NVMe drive bays |
M.2 |
• M.2 Interface: PCI-E 3.0 x4 |
System Cooling
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Fans | • 8x 8cm 13.5k RPM rear fans per enclosure |
Power Supply
| |
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2200W or 2000W Redundant Power Supplies with PMBus | |
Total Output Power and Input |
• 1200W with Input 100-127Vac • 1800W with Input 200-220Vac • 1980W with Input 220-230Vac • 2090W with Input 230-240Vac • 2200W with Input 220-240Vac (for UL/cUL use only) • 2090W with Input 230-240Vdc (for CCC only) |
AC Input Frequency |
• 50-60Hz |
Dimension
(W x H x L) |
• 76 x 40 x 336 mm |
+12V | • Max: 100A / Min: 0A (100-127Vac) • Max: 150A / Min: 0A (200-220Vac) • Max: 165A / Min: 0A (220-230Vac) • Max: 174.17A / Min: 0A (230-240Vac) • Max: 183.3A / Min: 0A (220-240Vac) |
5VSB | • Max: 1A / Min: 0A |
Output Type | • Backplanes (gold finger) |
Certification | • Titanium Level |
Operating Environment
| |
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RoHS |
• RoHS Compliant |
Environmental Spec. |
• Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F) • Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) • Operating Relative Humidity: 8% to 90% (non-condensing) • Non-operating Relative Humidity: 5% to 95% (non-condensing) |